PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE PACKAGE SUBSTRATES, AND METHODS FOR FABRICATING THE SEMICONDUCTOR PACKAGES

摘要

Package substrates, semiconductor packages including the package substrates, and methods for fabricating the semiconductor packages are provided. A package substrate may include a core including a first surface on which a semiconductor chip is disposed and a second surface opposite the first surface. The package substrate may also include a metal pad on the second surface of the core. The metal pad may include a saline water corrosion resistant surface.