| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser device in which positioning accuracy of a semiconductor laser chip can be improved, required perpendicularity of a side face of a sub-mount can be alleviated, and noise can be lowered.SOLUTION: A semiconductor laser chip 1 is bonded to a sub-mount 2 by using a soldering material such as AuSn so as to form a semiconductor laser chip having a sub-mount. The semiconductor laser chip having a sub-mount is attached to a magnetic head 6 by using an adhesive. Both electrodes of the semiconductor laser chip 1 are electrically continued by using wire bonding or the like so as to oscillate the semiconductor laser chip 1. An optical component 15 is temporarily place immediately above a hole formed on the sub-mount 2. The optical component 15 has a face which reflects TE mode light and passes TM mode light and a face which has a function equivalent to a quarter wavelength plate. |
