摘要 |
A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, a liquid receiving part, and an upper nozzle. The chamber includes a chamber body and a chamber cover, and the chamber cover is moved up and down. While the chamber cover is in contact with the chamber body, a small sealed space is formed and some processings involving pressure reduction or pressurization are performed. When the chamber cover is moved up, an annular opening is formed between the chamber cover and the chamber body. On an outer side relative to the annular opening, positioned are a first cup part and a second cup part. A processing liquid spattering from a substrate is received by the first cup part or the second cup part. In the substrate processing apparatus, it is possible to perform various processings in the small chamber. |