发明名称 |
PULL-BACK DESIGN TO MITIGATE PLASTIC SENSOR CRACKS |
摘要 |
The described embodiments relate generally to the singulation of circuits and more particularly to a method of cutting of a polymer substrate that is overlaid with a conductive element and a passivation layer. In one embodiment, the passivation layer is applied selectively to the polymer substrate in an area covering the conductive element and extending at least a first distance past an outer edge of the conductive element. Then, a cutting operation is performed along a cutting path located a second distance from an outer edge of the passivation layer. The second distance is a minimum distance between the edge of the passivation layer and the cutting path that prevents a load applied at the second distance from causing a stress crack in the passivation layer. |
申请公布号 |
US2014065321(A1) |
申请公布日期 |
2014.03.06 |
申请号 |
US201213602029 |
申请日期 |
2012.08.31 |
申请人 |
CHUNG WONSUK;TUNG CHUN-HAO;TSENG YU-CHUN;KANG SUNGGU;ZHONG JOHN Z.;MOHAPATRA SIDDHARTH;APPLE INC. |
发明人 |
CHUNG WONSUK;TUNG CHUN-HAO;TSENG YU-CHUN;KANG SUNGGU;ZHONG JOHN Z.;MOHAPATRA SIDDHARTH |
分类号 |
H05K3/00 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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