| 摘要 |
In accordance with an embodiment, a coordinate correcting method includes generating a pattern image for matching from an SEM image acquired by an electron microscope in accordance with a defect coordinate, performing matching between a defect image and the pattern image, superimposing the defect image and the pattern image between which the matching has been performed on a difference image, specifying a position to which a defect position on the difference image corresponds on the pattern image, and converting the corresponding position on the SEM image to a coordinate on a wafer. The defect coordinate, the defect image and the difference image are obtained by a defect inspection apparatus. |
