| 摘要 |
PROBLEM TO BE SOLVED: To provide a coupling substrate excellent in dividing accuracy, reduced in generation of burrs or chips in each element substrate after having been divided, and capable of suppressing a sealing material from infiltrating on a mounting face.SOLUTION: In a coupling substrate 1, a plurality of element substrates 3 partitioned by a dividing groove 5 extending longitudinally and laterally are formed in a mother substrate 2 made of an inorganic insulating material. Each of the element substrates 3 has a sealing region 8 on a part of which a light emitting element is mounted and the whole of which is sealed with a sealing material. The surface roughness Ra in a region in contact with the sealing region 8 is 0.15 μm or less, and the surface roughness Ra in a groove inner face 51 of the dividing groove 5 is 0.15-0.5 μm. |
