EXFOLIABLE COPPER FOIL ATTACHED SUBSTRATE AND CIRCUIT BOARD PRODUCING METHOD

摘要

The present invention provides an exfoliable copper foil attached substrate characterized in that a coreless circuit board can be produced easily at lower production costs and lower raw material costs than conventionally. The substrate includes a support layer (4) and a release resin layer attached copper foil (3) obtained by providing a release resin layer (2) on one surface of a copper foil (1), wherein the release resin layer attached copper foil (3) is integrally laminated with the support layer (4), having the release resin layer (2) positioned at the bonding surface. At the release resin layer (2), the copper foil (1) and the support layer (4) are exfoliable from each other. When the copper foil (1) and the support layer (4) are exfoliated from each other, the peeling intensity is 20 to 300 N/m.