摘要 |
The present invention relates to a device for automatically aligning and picking-up a tape reel for a semiconductor package to keep a label attaching surface at a different position placed at a regular position in picking-up one stacked tape reel. The present invention enables an align pick-up plate positioned at the upper part of the tape reel to rotate while simultaneously confirming the position of the tape reel before allowing the align pick-up plate to pickup the tape reel with vacuum absorbing while moving to a lower direction and also, enables the tape reel to be automatically aligned to the regular position through controlling the tape reel to rotate and return to a standard position as much as the amount of the rotation for confirming the position of the picked up align pick-up plate. |