| 摘要 |
<p>In an RFID tag mounting package mounted with an RFID tag and a manufacturing method thereof, in order to have sufficient communication performance without spoiling the design property of the package to which a conductive film is applied, a package (30) is obtained by assembling a structural material (32) in which a metallic film (12) is formed on a base material (11) made of paper or the like. In the package (30), a slot (13) is provided in the metallic film (12) of a folded portion (35), in a spot where portions (the folded portion (35) and an external packaging portion (36)) of the structural material (32) overlap each other. An inlet (51) operates as an RFID tag, includes an antenna (53) and an IC chip (52) connected to the antenna (53), and is mounted on the inner surface of the folded portion (35) in conformity with the position of the slot (13).
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