| 摘要 |
The present invention relates to an electronic device assembly comprising a basic material; a first insulation layer formed on the basic material; multiple wire layers separately arranged at the upper part of the first insulation layer and formed with an aluminum material allowing wire bonding; multiple second insulation layers separately arranged on the part of the multiple wire layers; an electronic device chip positioned at the upper part of a wire layer among the multiple wire layers, where the second insulation layer is not formed; and a wire having one end connected to the electronic device chip and the other end directly connected to the wire layer. As such, the wire layer is formed by using a material allowing the wire bonding. Thus, the wire can be directly bonded to the wire layer through a wire bonding process without forming an additional plating layer for wire bonding on a copper wire layer. Thus, the manufacturing process of the electronic device assembly becomes simple and processing time and costs can be reduced. Also, heat can be easily radiated since there is no increase in the separation distance between the basic material and the wire layer. |
