| 摘要 |
<p>An object of the present invention is to obtain a polyamide-imide solution that has a low linear thermal expansion coefficient, that is, an excellent linear thermal expansion coefficient, and that also is excellent in coating applicability. A further object of the present invention is to provide, with use of the polyamide-imide solution, a product or member which has high requirements for heat resistance and a low linear thermal expansion coefficient. In particular, the present invention is intended to provide a product or member that is suitably used for applications in which the polyamide-imide film obtained from the polyamide-imide solution of the present invention is formed on a surface of an inorganic material such as metal, metal oxide, or monocrystalline silicon. The above objects can be achieved by a polyamide-imide solution including: a specific polyamide-imide; and an organic solvent, the organic solvent being a mixture solvent of an amide solvent and a non-amide solvent, the non-amide solvent being at least one solvent selected from the group consisting of ether solvents, ketone solvents, ester solvents, glycol ether solvents, and glycol ester solvents.</p> |
