发明名称 APARATUS OF REFORMING ROUND SURFACE FOR BACKING PLATE
摘要 The present invention relates to an apparatus for reforming a backing plate comprising: a cutting tool for surface grinding a backing plate; a main body where a guide roller is fixed to one side, and to which the cutting tool is combined to be able to be operated; an X-Y table moving part to which a backing plate is fixed to maintain verticality with the cutting plate, and which is attached to the main body to be able to be moved horizontally; and a guide line closely attached to the guide roller fixed to the main body. Since an X-Y table guide attached to the X-Y table moving part is comprised to induce movement which is the same as a form of the guide line, the surface processing time is reduced by using a special equipment without an additional grinder work when reprocessing of a backing plate is needed. Provided is the apparatus for reforming a backing plate which can form a uniform welding back bead when a backing plate where surface reprocessing is completed is used, and which can perform a repetitively processing work when a backing plate of the same round is surface reprocessed.
申请公布号 KR20140026006(A) 申请公布日期 2014.03.05
申请号 KR20120092854 申请日期 2012.08.24
申请人 GEC CO., LTD. 发明人 YOON, SEOK PHIL;KIM, KYUNG MIN;KIM, DONG GWAN;LEE, SHIN WOO;HA, JUNG HUN
分类号 B24B9/04 主分类号 B24B9/04
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