发明名称 |
Method for manufacturing a printed circuit board and a printed circuit board obtained by the manufacturing method |
摘要 |
A method for manufacturing a printed circuit board enables a metal residue between wirings to be removed inexpensively without side etching of a copper layer while having sufficient insulation reliability for micro wiring working. The method includes forming a base metal layer directly at least on one face of an insulator film without an adhesive, and a copper coat layer formed on the base metal layer to form adhesiveless copper clad laminates, then forming a pattern on the adhesiveless copper clad laminates by an etching method. The etching method includes a process of etching treatment for the adhesiveless copper clad laminates with an iron (III) chloride solution or a copper (II) chloride solution containing hydrochloric acid and then, a process of treatment with an acid oxidant containing potassium permanganate. |
申请公布号 |
US8663484(B2) |
申请公布日期 |
2014.03.04 |
申请号 |
US20080452479 |
申请日期 |
2008.06.23 |
申请人 |
NAGAO HARUMI;ASAKAWA YOSHIYUKI;SUMITOMO METAL MINING CO., LTD. |
发明人 |
NAGAO HARUMI;ASAKAWA YOSHIYUKI |
分类号 |
H01B13/00 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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