发明名称 COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD FOR PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICE, AND COPPER ALLOY ROLLED MATERIAL FOR ELECTRONIC DEVICE
摘要 One aspect of this copper alloy for an electronic device is composed of a binary alloy of Cu and Mg which includes Mg at a content of 3.3 to 6.9 atomic%, with a remainder being Cu and inevitable impurities, and a conductivity à (%IACS) is within the following range when the content of Mg is given as A atomic%, Another aspect of this copper alloy for an electronic device is composed of a ternary alloy of Cu, Mg, and Zn which includes Mg at a content of 3.3 to 6.9 atomic% and Zn at a content of 0.1 to 10 atomic%, with a remainder being Cu and inevitable impurities, and a conductivity à (%IACS) is within the following range when the content of Mg is given as A atomic% and the content of Zn is given as B atomic%,
申请公布号 KR101369693(B1) 申请公布日期 2014.03.04
申请号 KR20127025942 申请日期 2011.05.13
申请人 发明人
分类号 C22C9/00;C22C9/04;C22F1/08;H01B1/02 主分类号 C22C9/00
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