| 摘要 |
A solid-state imaging apparatus including an insulating structural body having a through opening, a wiring part formed on a front surface of the structural body, a solid-state imaging element which is connected to the wiring part and also is attached to the structural body so as to close the through opening, a translucent member which is opposed to the solid-state imaging element and is attached to the structural body through an adhesive inside an adhesion region R so as to close the through opening, and a solder resist film with which at least a part of the front surface of the structural body is covered, and is characterized in that a region R0 in which the solder resist film is selectively removed is had in the adhesion region R and the removed region R0 is filled with the adhesive. |
