发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>Provided is a photosensitive resin composition comprising: a resin; a polymeric compound; a polymerization initiator; and a compound indicated as formula (1), wherein the resin has a structure unit derived from at least one type selected from a group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydrid, and the copolymer a structure unit derived from a monomer with a cyclic ether structure with 2-4 carbons, and an ethylenic unsaturated bond, and the polymerization initiator includes an O-acyloxime compound, and the content of the compound indicated as formula (1) is 0.25-3 weight parts based on 100 weight parts of the resin.′In formula (1), A^1-A^4 inpendently refer to an hydrogen atom or an alkyl group having 1-6 carbons.′</p>
申请公布号 KR20140024807(A) 申请公布日期 2014.03.03
申请号 KR20130097063 申请日期 2013.08.16
申请人 SUMITOMO CHEMICAL CO., LTD. 发明人 INOUE KATSUHARU
分类号 G03F7/004;G02F1/13 主分类号 G03F7/004
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