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发明名称
软式印刷电路板副资材
摘要
申请公布号
TWM473676
申请公布日期
2014.03.01
申请号
TW102218488
申请日期
2013.10.03
申请人
台郡科技股份有限公司 高雄市大寮区大发工业区莒光一街23号
发明人
李兆棋;张宝键;林敬晴;曾松裕;连春智
分类号
H05K3/10
主分类号
H05K3/10
代理机构
代理人
桂齐恒 台北市中山区长安东路2段112号9楼;林景郁 台北市中山区长安东路2段112号9楼
主权项
地址
高雄市大寮区大发工业区莒光一街23号
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