| 摘要 |
<p>PURPOSE: A light emitting diode (LED) lamp module is provided to reduce manufacturing costs by being formed in order to be electrically connected with a metal film through wedge bonding. CONSTITUTION: Heat radiation substrates (100) comprise an aluminum (AI) film (130) and a heat radiation film (110). The AI film is made of AI and an Al group alloy and is patterned on the heat radiation film. One or more LED chips (200) are installed on a flexible heat radiation substrate and are electrically connected to the AI film through wedge bonding using an AI wire which is made of the AI and the Al group alloy. A waterproofing layer (300) is closely formed on the upper surface of the flexible heat radiation substrate in order to surround the one or more LED chips and the AI wire. The waterproofing layer is made of waterproofing resin having high transparency.</p> |
