发明名称 SYSTEM AND METHOD FOR TEMPERATURE CONTROL OF SEMICONDUCTOR WAFER
摘要 PROBLEM TO BE SOLVED: To provide a system and a method for temperature control of a semiconductor wafer.SOLUTION: The semiconductor wafer is received in a first chamber which is in a first pressure level. A semiconductor wafer is in a first temperature and heated up to a second temperature by a first heating module. On the other hand, a pressure level in the first chamber is reduced from the first pressure level to a second pressure level. Then, the semiconductor wafer is supplied to a support element of a second chamber which maintains a third pressure level closer to the second pressure level than the first pressure level, and the support element is in a third temperature closer to the second temperature than the first temperature.
申请公布号 JP2014039001(A) 申请公布日期 2014.02.27
申请号 JP20120280174 申请日期 2012.12.05
申请人 APPLIED MATERIALS ISRAEL LTD 发明人 SHAVIT LAVY;KRAUS RAFI;ITZAK YAIR;SAMUEL NACKASH;BELENKY YURI
分类号 H01L21/02;H01L21/027;H01L21/683 主分类号 H01L21/02
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