| 摘要 |
According to one embodiment, a semiconductor device includes a light-emitting element, a light-receiving element, a primary side lead electrically connected to the light-emitting element, a secondary side lead electrically connected to the light-receiving element and a molded body. The molded body includes an internal resin, an external resin and a light shielding layer. The internal resin covers a portion fixed with the light-emitting element of the primary side lead and a portion fixed with the light-receiving element of the secondary side lead. The external resin covers the internal resin, and shields external light to which the light-receiving element is sensitive. The light shielding layer is provided at a position closer to the second surface than any of the light-emitting element, the light-receiving element, the primary side lead, and the secondary side lead, and shielding the external light. |
