发明名称 METAL FILM POLISHING PAD AND POLISHING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide: a metal film polishing pad achieving a high polishing speed and having polishing performance with excellent polishing uniformity; and a polishing method using the polishing pad.SOLUTION: A metal film polishing pad has a concentric circle groove with a land width (x) of 5.0-7.0 (mm) and a groove width of 0.25-0.75 (mm).
申请公布号 JP2014038916(A) 申请公布日期 2014.02.27
申请号 JP20120179665 申请日期 2012.08.14
申请人 KURARAY CO LTD 发明人 TAKEKOSHI YUTAKA;OKAMOTO TOMOHIRO
分类号 H01L21/304;B24B37/24;B24B37/26 主分类号 H01L21/304
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