发明名称 |
METAL FILM POLISHING PAD AND POLISHING METHOD USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide: a metal film polishing pad achieving a high polishing speed and having polishing performance with excellent polishing uniformity; and a polishing method using the polishing pad.SOLUTION: A metal film polishing pad has a concentric circle groove with a land width (x) of 5.0-7.0 (mm) and a groove width of 0.25-0.75 (mm). |
申请公布号 |
JP2014038916(A) |
申请公布日期 |
2014.02.27 |
申请号 |
JP20120179665 |
申请日期 |
2012.08.14 |
申请人 |
KURARAY CO LTD |
发明人 |
TAKEKOSHI YUTAKA;OKAMOTO TOMOHIRO |
分类号 |
H01L21/304;B24B37/24;B24B37/26 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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