Manufacture of thinned substrate imagers

摘要

The front surface, with at least one imager formed thereon, of a semiconductor wafer and the a peripheral edge of the back surface of the wafer are protected by either coating them or by placing the wafer in a special fixture. The so protected wafer is then placed in a chemical bath and thinned to the desired thickness over the entire center region of the back surface. Then a sheet of glass 20 which fits into the thin region within the unthinned rim on the back surface is glued to the back surface using pressure 22, to provide a laminated structure, e.g. after curing. The pressure, e.g. in vacuo, forces the adhesive outward and removes bubbles and voids before the preferred curing. In the case where more than one imager has been formed on the wafers front surface, individual imager devices are separated from one another by cutting through the glass 20 and thinned substrate along lines between the devices.