发明名称 PACKAGE FOR LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING DEVICE
摘要 <p>The present invention provides a package capable of preventing deformation centered in a resin portion between lead electrodes, and a light-emitting device using the package. A package (2) has lead electrodes (10, 20), and a resin molded body (3) in which the lead electrodes (10, 20) are molded, the resin molded body (3) being ring-shaped, and a cup part (3a) for positioning a light-emitting element being provided on the inner side of the resin molded body (3). The lead electrode (20) is provided with a reinforcing part (30) extending along the lateral side of the lead electrode (10). The reinforcing part (30) is embedded in a corner section (3C) of the resin molded body (3).</p>
申请公布号 WO2014030530(A1) 申请公布日期 2014.02.27
申请号 WO2013JP71110 申请日期 2013.08.05
申请人 MITSUBISHI PLASTICS, INC. 发明人 UMEDA, KAZUNORI;MATSUI, JUN;KATOU, YUKIO
分类号 H01L33/62 主分类号 H01L33/62
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