MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

摘要

A method for manufacturing a multilayer FPCB includes certain steps. A first printed circuit substrate is provided, the first printed circuit substrate includes a first copper layer and a first protective film, the film defining a first opening. A second printed circuit substrate is provided, this substrate includes a second copper layer and a second protective film. The second protective film defines a second opening. The first printed circuit substrate is laminated together with the second printed circuit substrate by an adhesive sheet. The adhesive sheet defines a third opening in communication with and aligned with the first opening and the second opening. The first copper layer is then etched to form a first outer wiring layer and the third copper layer is also etched to form a second outer wiring layer, thereby obtaining a multilayer FPCB.