| 摘要 |
A semiconductor memory device having an alignment key structure is disclosed. According to an embodiment of the present invention, the semiconductor memory device includes a first chip and a second chip which is physically and electrically connected to the first chip. The first chip is connected to the second chip by a TSV formed on a first area. The first chip is electrically connected to the second chip by an alignment key formed on a second area. [Reference numerals] (AA) Start |
