| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum vapor-deposition device that can make a film deposition chamber compact and shorten the time needed for evacuation.SOLUTION: A vacuum vapor-deposition device 1 includes a film deposition chamber 2 and a series ejection circuit 3 which vaporizes and ejects a film deposition material toward a base material 11. The ejection circuit 3 comprises vaporization parts 10a-10j, a manifold group 6, a film deposition material ejection part 13, and a shutter member 8. The vacuum vapor-deposition device 1 has the majority of the ejection circuit 3 put outside the film deposition chamber 2. The vacuum vapor-deposition device 1 is provided with main-body parts 37, 38, and 39 of three manifold parts 66, 67, and 68 all provided outside the film deposition chamber 2. Only tip sides of extension pipes 75, 76, and 77 attached to the respective manifold parts 66, 67, and 68 and the film deposition material ejection part 13 are provided in the film deposition chamber 2. |
