| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a junction structure reducing the number of joining processes. SOLUTION: The method of manufacturing the junction structure includes: sandwiching an anisotropically conductive film 69 between a wiring 52 exposed in one side of a flexible circuit board 5 and a wiring 61 formed in a flexible circuit board 6; sandwiching an anisotropically conductive film 79 between a wiring 53 exposed in another side of the flexible circuit board 5 and located in the right backside of the wiring 61 and a wiring 71 formed in a flexible circuit board 7; and heating simultaneously the anisotropically conductive films 69, 79 to join the wiring 52 and the wiring 61 with the anisotropically conductive film 69 and to simultaneously join the wiring 53 and the wiring 71 with the anisotropically conductive film 79. COPYRIGHT: (C)2010,JPO&INPIT |
