Electronic Device Enclosures Ventilation to Dissipate Heat

摘要

Electronic device enclosures providing improved heat dissipation, an enclosure 202 for holding an electronic circuit board 206 (see figure 2C) includes a housing having first openings 510a and second openings 510b, the first openings direct airflow in a downward direction and the second opening direct airflow in an upward direction, a baffle 246 (see figure 6) is coupled to the housing to substantially visually obscure the openings to direct the convection airflow across in the first opening and out the second opening.