COOLING APPARATUS FOR CUTTING SUBSTRATE AND LASER CUTTING SYSTEM COMPRISING THE SAME

摘要

The present invention relates to a cooling apparatus for cutting substrates and a laser cutting system comprising the same. The cooling apparatus for cutting substrates comprises a cooling unit which can spray coolant along the cut predicting lines of a substrate, adjust separation distance with laser beam irradiated from a scanner unit and spray angles of the coolant. The cooling unit comprises: a body unit which provides an accommodation space for accommodating the coolant; a nozzle unit which discharges the coolant supplied from the body unit; and a cooling unit gathering unit which is installed between the body unit and the nozzle unit and adjusts spray angles of the coolant sprayed through the nozzle unit by adjusting angles of the nozzle unit.