发明名称 WIRING SUBSTRATE
摘要 <p>A wiring substrate (10, 40, 60. 80) includes a wiring pattern (13, 21, 41, 43, 65, 83a, 83b, 83c) and an insulating layer (11, 26, 48, 81) to which the wiring pattern is fixed. The insulating layer includes an edge. The wiring pattern (13, 21, 41, 43, 65, 83a, 83b, 83c) includes a joint portion (14, 44, 66) connected with the insulating layer (11, 26, 48, 81) and an extended portion (45, 45, 67, 85) that extends from the joint portion (14, 44, 66) and protrudes from the edge of the insulating layer (11, 26, 48, 81). The insulating layer (11, 26, 48, 81) or the joint portion (14, 44, 66) includes an outermost surface. A connection terminal (T, T1) is provided by bending the extended portion (45, 45, 67, 85) so that a part of the extended portion (45, 45, 67, 85) is protruded from the outermost surface of the insulating layer (11, 26, 48, 81) or the joint portion (14, 44, 66).</p>
申请公布号 EP2701472(A1) 申请公布日期 2014.02.26
申请号 EP20120774530 申请日期 2012.01.06
申请人 KABUSHIKI KAISHA TOYOTA JIDOSHOKKI 发明人 SHIMADU, HITOSHI;SAWADA, TAKEHIKO;HAYAKAWA, TAKAHIRO;ASAI, TOMOAKI;YAMAUCHI, RYOU
分类号 H05K1/11;H05K1/02;H05K1/14;H05K3/36;H05K3/40 主分类号 H05K1/11
代理机构 代理人
主权项
地址