| 摘要 |
The present invention relates to a high density probe card for determining whether or not the failure of a semiconductor integrated circuit. The probe card of the present invention includes a probe unit, an interposer unit, and a main substrate unit. The probe unit includes a plurality of probes connected to an electrode pad of the integrated circuit and a wiring substrate connected to a plurality of probes. A proton is electrically connected as a plurality of probes is fixed on the top of the wiring substrate. The wiring substrate has a pattern circuit on the upper/lower surface and is vertically energize through an electrode hole. The main substrate unit includes a top plate, a bottom plate, a transmission line, and a via hole and in which a plurality of circuit patterns for testing is formed. The interposer unit has a conductive elastic structure, located between the wiring substrate and the main substrate unit to be electrically connected, and in which a thickness of the central part connected to the probe unit is thicker than a thickness of a connector assembly unit of the main substrate unit connected to the tester as the area of the top plate is formed to be smaller than the area of the bottom plate. According to the probe card of the present invention, the amount of semiconductors for simultaneous testing is maximized by manufacturing multi-staged PCB, replacing a space transformer of existing probe cards, and improving the performance and semiconductor test costs can be reduced thereby. |
