| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for an insulation layer of a multilayer printed board, which is not only low in arithmetic average roughness on an insulation layer surface but also low in root-mean-square roughness in a wet roughening process, capable of forming a plated conductor layer having sufficient peel strength thereon, and is also low in linear thermal expansion coefficient.SOLUTION: A resin composition for an insulation layer of a multilayer printed board contains an epoxy resin having a xylene structure, a hardener, and an inorganic filler. |
