| 摘要 |
<p>A light emitting device includes a substrate, a light emitting element, a first resin member and a second resin member. The substrate includes a base member, a plurality of wiring portions disposed on a surface of the base member, and a covering layer covering the wiring portions with an opening formed in a part of the covering layer. The light emitting element is arranged on the substrate in the opening of the covering layer and having an upper surface at a position higher than the covering layer. The first resin member is arranged at least in the opening of the covering layer and at periphery of the light emitting element. The second resin member seals the substrate and the light emitting element. The second resin member is disposed in contact with the first resin member.</p> |
