| 发明名称 |
ADHESIVE COMPOSITION, FILM ADHESIVE, AND BONDING METHOD |
| 摘要 |
<p>An adhesive composition relates to the present invention is an adhesive composition having elastomer as a main component. An adhesive layer formed using the adhesive composition satisfies at least one among 20000 Pa or higher of storage moduls at 220°C and 20000 Pa or higher of loss modulus at 220°C.</p> |
| 申请公布号 |
KR20140021966(A) |
申请公布日期 |
2014.02.21 |
| 申请号 |
KR20130091419 |
申请日期 |
2013.08.01 |
| 申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
NOGUCHI TAKUYA;OGATA TOSHIYUKI;KUBO ATSUSHI;IMAI HIROFUMI;YOSHIOKA TAKAHIRO |
| 分类号 |
C09J9/00;C09J7/02;C09J109/06;H01L21/02 |
主分类号 |
C09J9/00 |
| 代理机构 |
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