| 摘要 |
PROBLEM TO BE SOLVED: To relax stress concentration on a junction between a solder bump and an electrode pad in a heat cycle time or the like in the case of mounting a semiconductor chip on a substrate.SOLUTION: An LSI chip electrode pad straight side 23 as one side of a triangle forming an LSI chip electrode pad 3 is almost vertical to a straight line going toward an LSI chip central direction 25, and arranged at the side of an LSI chip center 21 with respect to the other sides of the triangle forming the LSI chip electrode pad 3. On the other hand, a substrate electrode pad straight side 24 as one side of the triangle forming the substrate electrode pad 4 is almost vertical to a straight line going toward the LSI chip central direction 25, and arranged at an outer peripheral side at the opposite side of the LSI chip center 21 with respect to the other sides of the triangle forming a substrate electrode pad 4. The LSI chip electrode 3 and the substrate electrode pad 4 are joined by a bump 7 to form a joint structure 10, and positioned in point symmetry with a bump center 22 of the bump. |
