| 摘要 |
A thermally enhanced wiring board with thermal pad and electrical post includes a metal slug, a metal pillar, a patterned interconnect substrate, an adhesive, a build-up circuitry and optionally a plated through hole. The metal slug and the metal pillar extend into apertures of the patterned interconnect substrate and are electrically connected to the build-up circuitry. The build-up circuitry covers the metal slug, the metal pillar and the patterned interconnect substrate and can provide signal routing. The metal slug can provide thermal contact surface, and the metal pillar can serve as power/ground plane or signal vertical transduction pathway. |
