| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device in which a desired amount even of a new polishing pad, exchanged just before, can be polished and removed.SOLUTION: A polishing device for polishing a workpiece includes a chuck table for holding the workpiece rotatably, polishing means having a polishing pad for polishing a workpiece held on the chuck table, and control means for controlling at least the polishing means and the chuck table, so as to polish the workpiece by the polishing means for a first predetermined polishing time and to polish and remove a desired amount thereof. The control means stores an exchange timing of exchanging a polishing pad to a new one, and performs practice polishing of the workpiece for a second predetermined time immediately after exchange of the polishing pad and before polishing the workpiece, and then polishes the workpiece by the polishing means for the first predetermined polishing time. |
