PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board and a method of manufacturing the printed circuit board, which are capable of simultaneously forming a via and a circuit pattern to thus reduce a process time and reducing noise of an electrical signal in connecting layers.SOLUTION: A printed circuit board 100 includes: a base substrate 110, a photosensitive insulating layer 130 formed on an upper portion of the base substrate 110 and comprising a first photosensitive insulating film 131 and a second photosensitive insulating film 132 that have different levels of sensitivity; and a first circuit pattern 120 formed to be buried in the photosensitive insulating film 130.