发明名称 METHOD FOR PRODUCING BONDED PRODUCT, METHOD FOR FORMING ADHESIVE PATTERN, AND ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide an adhesive for forming an adhesive pattern which has a good pattern shape and is capable of bonding adherends together with sufficient adhesive strength, and to provide a method for producing a bonded product and a method for forming an adhesive pattern using the adhesive.SOLUTION: The method for producing a bonded product in which a first adherend and a second adherend are bonded together via an adhesive pattern comprises the steps of: providing, on the first adherend, an adhesive layer comprising an adhesive containing a polyimide compound obtained by reacting an acid anhydride, which contains 30 mol% or more of a tetracarboxylic acid dianhydride represented by general formula (I) based on the total amount of the acid anhydride, with diamine; etching a predetermined portion of the adhesive layer with an etchant containing water, an alkaline compound, and a nucleophilic agent or a hydrazine-based etchant to form an adhesive pattern; and bonding the second adherend to the adhesive pattern. In the formula (I), n represents an integer of 2-20.
申请公布号 JP2014031422(A) 申请公布日期 2014.02.20
申请号 JP20120172220 申请日期 2012.08.02
申请人 HITACHI CHEMICAL CO LTD 发明人 IKEDA AYA;FUJII SHINJIRO;KAWAMORI TAKASHI
分类号 C09J179/08;B32B3/18;B32B27/34;C08G73/10;C09J5/00;C09J201/00 主分类号 C09J179/08
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