发明名称 ADDITION CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR APPARATUS COMPRISING SEMICONDUCTOR ELEMENT COATED WITH CURED MATERIAL OF SAID COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide: an addition curable silicone composition which exhibits a low viscosity, preferable curability, a large refractive index, a high light transmittance, preferable adhesion to a substrate, crack resistance, and a low gas permeability; and a semiconductor apparatus comprising a semiconductor element subjected to cured coating with the composition.SOLUTION: The addition curable silicone composition contains: (A) an organopolysiloxane represented by the unit formula (1) defined by (RSiO)(RSiO)(RSiO)(XO); (B) an organopolysiloxane represented by the unit formula (2) defined by (RSiO)(RSiO)(RSiO)(XO); and (C) an organohydrogenpolysiloxane represented by the specified general formula (3) and having at least two Si-H bonds in a molecule. The content of component (C) is 1-200 pts.mass relative to the summed content 100 pts.mass of (A) and (B) components.
申请公布号 JP2014031394(A) 申请公布日期 2014.02.20
申请号 JP20120170903 申请日期 2012.08.01
申请人 SHIN ETSU CHEM CO LTD 发明人 KOZAI TOSHIYUKI;MOGI KATSUNARI
分类号 C08L83/05;C08L83/07;H01L23/29;H01L23/31;H01L33/56 主分类号 C08L83/05
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