| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing agent that allows smooth polishing of a copper film at high polishing speed, and allows polishing treatment in a short time, thereby capable of securing sufficient productivity, even for use in applications that require polishing of thick metal films on high performance circuit boards, TSVs or the like.SOLUTION: A polishing agent is obtained by adjusting a composition to have a pH of 1.5-4, the composition containing an inorganic acid, an amino acid, a protective film-forming agent, an abrasive, an oxidizing agent, an organic acid and water. The amount of potassium hydroxide required to raise the pH of the composition without the organic acid to 4 is 0.10 mol or more with respect to 1 kg of the composition without the organic acid, the organic acid contains two or more carboxyl groups, and the logarithm of the inverse of the first acid dissociation constant (pKa1) is 3 or less. |
