SURFACE TREATING AGENT AND METHOD OF TREATING SURFACE

摘要

The present invention relates to a surface treating agent and a surface treating method capable of forming a film layer on a copper or copper-plated surface. As for an agent for treating a copper or copper-plated surface, the surface treating agent according to one embodiment of the present invention contains 0.1-5 parts by weight of benzimidazole-based compound according to a chemical formula, 0.5-20 parts by weight of organic acid, 0.8-1 part by weight of fatty acid, and 0.5-3 parts by weight of ultraviolet light absorber with respect to 100 parts by weight of water. The pH of the surface treating agent is 2-3. [Chemical formula 1](R1 is one among an alkyl group having 1-15 carbons and an aryl group, and R2 and R3 are one among an alkyl group having one or more carbons and a halogen.).