VIA STRUCTURE HAVING OPEN STUB AND PRINTED CIRCUIT BOAD HAVING IT

摘要

The present invention relates to a via structure with an open stub and a printed circuit board including the same. According to one embodiment of the present invention, suggested are the via structure with the open stub and the printed circuit board including the via with the open stub. Wherein, the via structure includes: a signal transmission via which passes through an insulation layer; top and bottom via pads which connect the signal transmission line to first and second transmission lines which are formed on the upper and lower sides of the insulation layer, respectively; and one or more open stubs which are connected to the outer circumference of each via pad to have shunt capacitance between ground patterns which are formed on the upper and lower sides of the insulation layer.