| 摘要 |
PURPOSE: A coating apparatus, a coating method, a coating developing apparatus and a recording media are provided to keep the uniformity of film thickness profile of a substrate by controlling a film thickness profile based on the number of rotation of the substrate when a coating solution is applied on the substrate. CONSTITUTION: A spin chuck(21) is composed to maintain the level of a wafer(W) by vacuum suction. The spin chuck rotates by a rotation driving unit(22). A guide ring(23) is installed in the lower part of the spin chuck. The section of the guide ring is mountain shape. A cup(24) is installed to surround the spin chuck and the guide ring and suppresses the scattering of a coating solution. An opening with bigger size than the size of the wafer is formed on the upper side of the cup in order to lift the spin chuck. An exhaust unit(26) is formed in the lower part of the cup and is connected to an exhaust pipe(26A). |
