Integrated circuit package with multiple dies and bundling of control signals

摘要

A package includes a first die and a second die, at least one of said first and second dies being a memory. The dies are connected to each other through an interface. The interface is configured to transport a plurality of control signals. The number of control signals is greater than a width of the interface. At least one of the first and second dies performs a configurable grouping so as to provide a plurality of groups of control signals. The signals within a group are transmitted across the interface together.