发明名称 |
Method of forming substrate for fluid ejection device |
摘要 |
A method of forming an opening through a substrate having a first side and a second side opposite the first side includes laser machining a first portion of the opening into the substrate from the second side toward the first side, and abrasive machining a second portion of the opening into the substrate. Abrasive machining the second portion of the opening into the substrate includes completing the opening through the substrate. |
申请公布号 |
US8653410(B2) |
申请公布日期 |
2014.02.18 |
申请号 |
US20050262068 |
申请日期 |
2005.10.28 |
申请人 |
MULLOY MICHAEL;SCOTT GRAEME;HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
MULLOY MICHAEL;SCOTT GRAEME |
分类号 |
B23K26/38;B23K26/12;B23K26/14;B41J2/16 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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