发明名称 Semiconductor structure made using improved multiple ion implantation process
摘要 Methods and apparatus provide for: a first source of plasma, wherein the plasma includes a first species of ions; a second source of plasma, wherein the plasma includes a second species of ions; selection of the plasma from the first and second sources; and acceleration the first species of ions or the second species of ions toward a semiconductor wafer.
申请公布号 US8652952(B2) 申请公布日期 2014.02.18
申请号 US201213471932 申请日期 2012.05.15
申请人 CHEREKDJIAN SARKO;CORNING INCORPORATED 发明人 CHEREKDJIAN SARKO
分类号 H01L21/26;H01L21/42 主分类号 H01L21/26
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