SELECTIVE FILLING METHOD OF INSULATING MATERIAL ON CIRCUIT BOARD BY SURFACE TREATMENT

摘要

Disclosed is a method for selectively filling an insulation material in a circuit substrate capable of minimizing non-efficiency according to face work and improving reliability. The method comprises a step for performing half-etching on one side of a conductive material and a step for filling the insulation material at an etching part. The present invention relates to the method for filling the insulation material on a circuit substrate which selectively fills the insulation material in a groove by forming grooves and bumps in the conductive material and processing the surface. Surface processing is performed by performing hydrophobic processing on an exposed surface of the groove and performing hydrophilic processing on an exposed surface of the bump. Provided is the method for filling the insulation material on the circuit substrate capable of selectively filling the insulation material in the only groove by spreading a hydrophobic insulation material after the surface processing. [Reference numerals] (AA) Start; (BB) End; (S101) Form a groove and a bump after forming a photo solder register layer on one side of a conductive material; (S102) Hydrophobic surface processing; (S103) Remove the photo solder register layer; (S104) Hydrophilic surface processing; (S105) Fill an insulation material