| 摘要 |
The present invention relates to a substrate vacuum bonding device and a system thereof. The present invention provides the vacuum bonding device comprising: a vacuum chamber which has an inside selectively maintained in a vacuum state or an atmospheric pressure state, and in which a bonding process for an upper substrate and a lower substrate is performed; a fixing plate which is positioned in an external upper side part of the vacuum chamber, and includes an upper fixing panel for flatness management of the substrates; a CCD camera unit which is configured on an upper surface of the fixing plate, and obtains alignment information along patterns formed on each of the substrates; an upper electrostatic chuck which is configured on the upper surface of the fixing plate, supports up and down movements of the upper substrate, and arranges the alignment of the upper substrate; and a lower electrostatic chuck which is positioned in the vacuum chamber and arranges the alignment of the lower substrate. Further, according to the present invention, an upper fixing panel is installed on the outside of the vacuum chamber, and each component for alignment arrangement of the substrate is installed in the upper fixing panel, thereby preventing deformation of each component by high vacuum in the vacuum chamber to minimize product defects. |
