发明名称 Semiconductor memory device and fabrication process thereof
摘要 A SRAM includes a first CMOS inverter of first and second MOS transistors connected in series, a second CMOS inverter of third and fourth MOS transistors connected in series and forming a flip-flop circuit together with the first CMOS inverter, and a polysilicon resistance element formed on a device isolation region, each of the first and third MOS transistors is formed in a device region of a first conductivity type and includes a second conductivity type drain region at an outer side of a sidewall insulation film of the gate electrode with a larger depth than a drain extension region thereof, wherein a source region is formed deeper than a drain extension region, the polysilicon gate electrode has a film thickness identical to a film thickness of the polysilicon resistance element, the source region and the polysilicon resistance element are doped with the same dopant element.
申请公布号 US8652896(B2) 申请公布日期 2014.02.18
申请号 US201213726940 申请日期 2012.12.26
申请人 FUJITSU SEMICONDUCTOR LIMITED 发明人 YASUDA MAKOTO
分类号 H01L21/8238 主分类号 H01L21/8238
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